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Reliable supplier of PCB components and electronic modules
Equipment & Quality Control
At Sheng Yeong Products Co., Ltd., we deliver high-reliability PCB assemblies and electronic modules through a fully automated SMT production line and comprehensive quality assurance system. From solder paste printing to final assembly and testing, every process is performed under strict IPC-A-610 standards, with full traceability and ESD protection.
Our FUJI NXT III SMT production line ensures precision placement for ultra-fine components down to 0201 size. Equipped with high-speed feeders, automated optical alignment, and continuous process monitoring, the line guarantees superior accuracy and throughput for large-scale PCB manufacturing.
FUJI NXT III, SMT Assembly, High-Speed Pick and Place, Precision Electronics Manufacturing.
Our SMT line integrates automated board loaders, conveyors, and COGNEX Smart Vision Sensors to manage board flow, barcode traceability, and component alignment. The system enables closed-loop quality control and fully supports Industry 4.0 digital manufacturing.
Automated SMT, COGNEX Vision, Traceability, Smart Manufacturing, Inline Inspection.
All soldering processes are carried out in lead-free reflow ovens under optimized thermal profiles. Temperature control is automatically adjusted to ensure every joint meet IPC and RoHS standards.
Lead-Free Reflow, Solder Quality, RoHS Compliant, IPC Standard.
Using TRI TR7700 AOI systems, each PCB undergoes 100% inspection to detect missing components, solder bridges, and polarity errors. High-resolution imaging combined with AI algorithms ensures consistent defect detection accuracy.
AOI, Automated Optical Inspection, TRI TR7700, Defect Detection.
The MIRTEC MV-6eM 3D AOI system adds three-dimensional solder height and coplanarity analysis, providing deeper insight into solder joint reliability and component placement.
MIRTEC MV-6eM, 3D AOI, SMT Quality, Optical Analysis
For through-hole components and power modules, Sheng Yeong utilizes fully automated wave soldering systems. This process ensures uniform solder coverage, high current endurance, and mechanical robustness for industrial assemblies.
Wave Soldering, THT, Power Module Assembly, Through-Hole.
Post-soldering, all boards enter the manual assembly and inspection line. Each workstation is equipped with ESD-safe benches, fume extraction, and functional testers, ensuring product reliability before final integration.
PCBA Assembly, ESD Workstation, Manual Inspection, Functional Test.
Skilled engineers conduct detailed AOI verification and rework checks on complex boards. Their expertise bridges the gap between automated inspection data and real-world product reliability.
AOI Engineer, Visual Inspection, SMT Validation, Rework Control
After verification, modules proceed to system-level assembly and testing. Each unit undergoes functional validation, current measurement, and final QA before shipment to ensure top-tier reliability.
Final Assembly, QA Testing, Functional Validation, System Integration
Every PCBA is inspected under strict IPC-A-610 standards, followed by comprehensive burn-in and reliability tests. Our dedication to quality control ensures that each shipment meets customer expectations worldwide.
Quality Control, IPC-A-610, Burn-in Test, Reliability Assurance
